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Solder Sn99Cu1 dia 1.5mm without liquid 2.5% lead-free 25gr-1kg
Soldering tin Sn99Cu1 dia 1.5mm with liquid 2.5% lead-free 25gr-1kg
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Technical specifications:
| Brand: | Evek |
| Country and Region of Production: | Germany |
| Manufacturer number: | Not applicable |
| Type: | wire |
| Material: | Sn 99% / Cu 1% |
| Operation area: | solder |
| Standard classifications: | |
| Material number: | S-Sn99Cu1 |
| Liquid content: | 2.5% |
| Liquid | DIN EN 29454-1 1.1.2.B |
| Additional Information: | |
| Melting point: | 227 ° C |
Description:
The solder is characterized by good electrical conductivity, low cost, reliability of working properties. It is resistant to electricity, which is suitable for copper wiring. Thanks to its high levitation, it is the perfect material for high-temperature soldering.
Areas of application:
- solder
- Railing construction
- food industry
- Beverage industry
- chemistry
- Household appliances
d - outside diameter
- Type
- Lötdraht
- material
- tin
- operation area
- Lötungen in der Elektrotechnik, zur Herstellung von elektronischen Geräten und Bauteilen, zum Löten von Leiterplatten- und Präzisionselementen
- density
- 7.31 g / cm³
- Melting point
- 227 °C
- Electrical resistance
- 12.6 µΩ·cm
- Electrical conductivity
- 3,72 MS/m
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