Solder tin Sn96.5Ag3Cu0.5 silver solder wire 0.5-1.2mm liquid 2% lead-free 25g-1kg

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Technical specifications:

Brand:	Evek
Country and Region of Production:	Germany
Manufacturer number:	Not applicable
Type:	wire
Material:	Sn 96.5% / Ag 3% / Cu 0.5%
Operation area:	Solder tin, solder wire

Description:

The soldering guarantees good strength and reliability of the soldered connections.

Applies to the manual and automatic soldering of electronic components on printing plates for surface and push-through installation.

The composition of the solder guarantees that the contact surface can be negated and at the same time has good capillary properties.

The solder joint has good mechanical and electrical properties. A small evaporation volume emerges during soldering.

Melting degree: 217 ° C

Areas of application:

electronics
Radio technology

d - outer diameter

Reference Schweißen und Löten, Löt, Sn96.5Ag3Cu0.5

Availability date: 2020-08-27

Data sheet

Type: Lötdraht
material: tin
operation area: Elektrotechnik, Elektromechanik, Elektronik
density: 7.38 g/cm³
Melting point: 217 - 219 °C
Thermal conductivity: 58 W/(m·K)
Electrical conductivity: 0.132 m/Ω mm²
tensile strenght: 500 N/mm²
Elongation at break: 19%

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