|Country and Region of Production:
||Sn 96.5% / Ag 3% / Cu 0.5%
||Solder tin, solder wire
The soldering guarantees good strength and reliability of the soldered connections.
Applies to the manual and automatic soldering of electronic components on printing plates for surface and push-through installation.
The composition of the solder guarantees that the contact surface can be negated and at the same time has good capillary properties.
The solder joint has good mechanical and electrical properties. A small evaporation volume emerges during soldering.
Melting degree: 217 ° C
Areas of application:
- Radio technology